A look at the technical specifications of MSI’s MPG X670E Carbon WiFi motherboard

It seems that Ryzen 7000 processors aren’t the only ones appearing in online listings these days, because yesterday MSI’s X670 motherboards were also listed by some Italian retailers and we were able to get some important technical specifications as well as their prices. Stay with Lion Tech.
Twitter user Momomo_US shared details of MSI’s new motherboards, citing three Italian retailers, Eurotronic, TekWorld, and City Web Shop. First of all, it should be noted that the announced prices are not final, and considering the tax and also the classification of different regions, the announced figures may be different from what we finally see.
A look at the technical specifications of MSI’s MPG X670E Carbon WiFi motherboard
The MPG X670E Carbon WiFi motherboard is a great flagship option for those who want to push the limits. The price of this powerful product starts from 562 euros and continues up to 640 euros. On the other hand, we have the Pro X670-P WiFi motherboard, whose price is announced between 374 and 416 euros.
Motherboard model | price range |
MSI MPG X670E Carbon WiFi | 562 euros to 640 euros |
MSI PRO X670-P WiFi | 374 euros to 426 euros |
At a glance, it can be seen that motherboards based on the X670 platform are priced higher than the previous X570 models and are still more expensive than the Z690 series. As mentioned, the MPG X670E Carbon WIFI motherboard is a high-performance all-in-one product that offers a large number of I/O ports. The general specifications of this product include the following:
- Expanded heat sink with heat pipe
- 18+2 phase circuit with 90 amp power stage
- Generation 5 lighting slot and M.2 port support along with a special cover for SSD heat dissipation
- Support for 2.5G Lan and Wifi 6E network port
- USB Type-C and DP 2.0 port support
Motherboard PRO X670-P WIFI
Also, another quality model of this family is the MSI PRO X670-P WIFI motherboard, which can guarantee the stable performance of all system components when working. This product uses the X670E chipset and is designed with a quality 10-layer printed circuit board. This is while the X670 series use a maximum of 8-layer printed circuit boards.
One of the main features of this attractive motherboard is support for 80 amp SPS power stage, support for M.2 port with special heatsink, USB Type-C port and DP 2.0 along with Wi-Fi 6 and Lan communication network.