Gig Bench confirms that Q3S relay will be equipped with Snapdragon 778G

The code RMX3461 as well as its associated code, RMX3463, have been visible since late September (early October) when they first appeared on TENAA for verification. Thus, it can be understood that the two devices are smartphones belonging to the Riley brand, some of whose external and internal specifications were also included. Be with Chicago.

Sources now claim that the code RMX3461 belongs to a smartphone that will be marketed as Realme Q3s and will carry Qualcomm’s Snapdragon 778 chip in its belly. The information on this Weibo source has now been verified by Gig Bench.

The smartphone has completed an experiment, which lists the motherboard as “lahaina” in its list. From this name, it can be understood that this phone will use Qualcomm Snapdragon 778 G chip. The Adreno 642L graphics chip will also accompany it. Therefore, there is no doubt that the chip in question will be 6 nanometers.

This device will have 8 GB of RAM and as you can see from the TENAA information, it should also come with 6 and 12 GB RAM options. It can also have storage capacity of 128, 256 and 512 GB. In addition, it will have a microSD slot, which can be used if you need more storage memory.

It is also rumored that the phone will have a 6.59-inch IPS LCD display with a refresh rate of 144 Hz, but a more comprehensive benchmark is needed before it can be confirmed.

However, the unveiling time of the Q3S reel phone could not be too far away as sources claim that the phone will be officially unveiled this month. The introduction of the Realme GT Neo2T is scheduled for October 19, so it is likely that this phone will be introduced at the event as well.